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Heating evaporation equipment - メーカー・企業と製品の一覧

Heating evaporation equipmentの製品一覧

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3-source resistance heating vapor deposition device

3-source resistance heating vapor deposition device

Equipped with an EB source expansion port! Compatible with 4-inch substrates, it features a substrate heating mechanism and a film thickness control mechanism!

This product is a three-source switchable resistance heating vapor deposition device aimed at metal materials. The square chamber improves maintainability. It supports 4-inch substrates and is equipped with a substrate heating mechanism and a film thickness control mechanism. 【Features】 ■ Substrate dimensions: 100×100 ■ Substrate heating temperature: Normal use 600℃ ■ Substrate rotation holder ■ Quartz film thickness gauge ■ EB source expansion port included ■ Resistance heating source: 100A three-source switchable *For more details, please refer to the PDF document or feel free to contact us.

  • Evaporation Equipment

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Resistance Heating Vapor Deposition Device DH300HD

Resistance Heating Vapor Deposition Device DH300HD

Scalability, operability, and safety are as robust as in the SD type.

The DH300HD (G/M) is a high-grade type equipped with a low-noise magnetic levitation TMP, designed to prevent contamination of the TMP by arranging the main angle valve and roughing line, allowing for sample exchange without stopping the pump. Additionally, it comes standard with a deposition monitor, enabling more precise film thickness control and automatic film formation.

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2D resistance heating vapor deposition device

2D resistance heating vapor deposition device

The vapor deposition source is of the boat type! The substrate is mounted on a plate on a support, and the height can be changed as desired.

The "2D Resistance Heating Vapor Deposition Device" is a system that allows for the easy vapor deposition of two materials using resistance heating. The deposition source is of the boat type, and the substrate is mounted on a plate supported by pillars, with adjustable height. The exhaust system utilizes both DP and RP, enabling high vacuum to be achieved in a short time. 【Features】 - The SUS upper chamber is equipped with two CF70 ports and two 50mm windows, while the lower chamber comes standard with six CF70 ports. - The upper chamber has a mechanism for vertical movement powered by electricity. - It comes standard with a film thickness gauge and can also operate in a gas atmosphere. - It allows for the easy vapor deposition of two different materials. *For more details, please refer to the external link page or feel free to contact us.

  • Evaporation Equipment

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Resistance Heating Vapor Deposition Device DH300SD

Resistance Heating Vapor Deposition Device DH300SD

The standard specification is for a resistance heating evaporation source type, with SDG being a glass bell jar and SDM being a metal bell jar (both manual handling).

The DH300SD (G/M) is a general-purpose compact deposition system that incorporates a deposition source into a φ300 bell-jar type high vacuum exhaust device equipped with a fast-rising wide-band TMP. It is designed with an emphasis on initial cost performance and is structured as a system with scalability for a wide range of applications, including research and development and pilot production in fields such as semiconductors, optics, and electronic components.

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